FamilyPackageCircuitVBRDSS (V)RDS(on) Max 4.5V (mOhms)RDS(on) Max 10V (mOhms)ID @ TC = 25C (A)ID @ TA = 25C (A)ID @ TA = 70C (A)Qg Typ (nC)Rth(JC) (K/W)Power Dissipation @ TA = 25C (W)Schottky VF (V)@ IFPbFPackage Class Can1K Budgetary Pricing (USD)HEXFET Power MOSFETs Discrete N-ChannelTO-262Discrete55RDS(on) Max 2.7V (mOhms) 6.5110ID @ TC = 100C (A) 76.0Qgd Typ (nC)0.90 Part StatusPbF Option AvailableThru-Hole0.988
IRF3205ZL |
RFQ for IRF3205ZL |
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| Technical/Catalog Information | IRF3205ZLPBF |
| Vendor | International Rectifier |
| Category | Discrete Semiconductor Products |
| Mounting Type | Through Hole |
| FET Polarity | N-Channel |
| Drain to Source Voltage (Vdss) | 55V |
| Current - Continuous Drain (Id) @ 25° C | 75A |
| Rds On (Max) @ Id, Vgs | 6.5 mOhm @ 66A, 10V |
| Input Capacitance (Ciss) @ Vds | 3450pF @ 25V |
| Power - Max | 170W |
| Packaging | Tube |
| Gate Charge (Qg) @ Vgs | 110nC @ 10V |
| Package / Case | TO-262-3 (Straight Leads) |
| FET Feature | Standard |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | IRF3205ZLPBF IRF3205ZLPBF |
| Product | Manufacturers | Pack | D/C | |||||||||||||||||
| IRF3205ZL | - | TO-262 | `06+(pb-free) |
Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low onresistance per silicon area. Additional features of this design are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating . These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.
Features |
| `Advanced Process Technology`Ultra Low On-Resistance`175 Operating Temperature`Fast Switching`Repetitive Avalanche Allowed up to Tjmax |
| Parameter | Max. | Units | |
| ID @ TC = 25 | Continuous Drain Current, VGS @ 10V (Silicon Limited) | 110 | A |
| ID @ TC = 100 | Continuous Drain Current, VGS @ 10V | 78 | |
| ID @ TC = 25 | Continuous Drain Current, VGS @ 10V (Package Limited) | 75 | |
| IDM | Pulsed Drain Current | 440 | |
| PD @ TC = 25 | Power Dissipation | 170 | W |
| Linear Derating Factor | 1.1 | W/ | |
| VGS | Gate-to-Source Voltage | ±20 | V |
| EAS(Thermally limited) | Single Pulse Avalanche Energy | 180 | mJ |
| EAS (tested) | Single Pulse Avalanche Energy Tested Value | 250 | |
| IAR | Avalanche Current | See Fig.12a, 12b, 15, 16 | A |
| EAR | Repetitive Avalanche Energy | mJ | |
| TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 175 | |
| Soldering Temperature, for 10 seconds | 300 (1.6mm from case ) | ||
| Mounting Torque, 6-32 or M3 screw | 10 lbf•in (1.1N•m) |